As SMT manufacturing becomes increasingly complex, the demand for high-quality data is also rising. A large number of components, a wide range of printed circuit boards, more new product introductions (NPIs) and a constantly changing production schedule are ongoing challenges that only the most intelligent software can handle.
For this reason, Mycronic’s Assembly Process Management (APM) software suite is tailored to the most complex manufacturing environment imaginable.
Mycronic MYCenter Analysis – Transparency and Efficiency
With Mycronic MYCenter Analysis, Mycronic offers powerful analysis and dashboard software designed to optimise modern SMT manufacturing processes. The solution enables comprehensive real-time monitoring of production lines and helps electronics manufacturers to achieve sustainable improvements in capacity utilisation, line balance and process quality.
MYPro Connect – Monitoring and Traceability
MYPro Connect enables the export of data from SMT assembly lines for the calculation of production KPIs (OEE, FPY, etc.), WIP tracking and plant-wide traceability. This enables programmes to be managed remotely, changeovers to be initiated and errors in programme selection to be prevented, particularly when changing over between variants.
MYPro Link – Intelligent process control
With MYPro Link, Mycronic offers a powerful software solution for optimising and networking modern SMT production processes. The software platform integrates SPI and AOI data into a central, web-based interface, thereby enabling significantly more transparent, efficient and quality-focused electronics manufacturing.
MYPro Create – Standardised SMT programming
With MYPro Create, Mycronic offers a modern software solution designed to simplify multi-machine programming in SMT manufacturing. The software enables programmes for jet printers, SPI and AOI systems to be created and centrally managed within a single user interface. This reduces the need for repeated data entry, shortens programming times and minimises sources of error.
