Selective brazing

Selective brazing for precise and reliable THT soldering processes

Selective soldering is now one of the most important soldering processes in modern electronics manufacturing, particularly for complex assemblies containing THT components and temperature-sensitive components. The solutions from Systronics AG Switzerland enable high-precision, reproducible and automated soldering of individual solder joints without subjecting surrounding components to thermal stress.

Through the targeted use of microwave, flux and preheating technologies, even complex printed circuit board layouts can be processed reliably. At the same time, electronics manufacturers benefit from high process reliability, low thermal stress, reduced material consumption and a high degree of flexibility when dealing with changing products and batch sizes. With its modular selective soldering systems, Systronics offers solutions for small and medium-sized production runs as well as for highly automated in-line manufacturing.

Reproducible selective soldering for small and medium batch sizes

Batch Inertec Cube.460 production cell

As a production cell, the Cube.460 is particularly suited to customers with small and medium-sized batch sizes.

It stands out thanks to its very well-thought-out design, particularly in terms of ease of use and accessibility. The soldering angle can be adjusted between 0° and 7°, making it possible to solder components that are not accessible vertically. With an optional camera, the machine can also be used as an AOI system, which is particularly advantageous when dealing with frequently changing products. PCBs measuring up to 460 x 460 mm can be processed, and this can also be done using lead-containing solder if required. Thanks to the quick-release system, solder nozzles can be replaced within a few seconds.

Manufacturer:

Inertec

Product:

Cube.460

Product website

Brochure

Video

Send enquiry

Modular in-line selective soldering

Inertec Cube Inline+ flexible in-line production system

The Cube inline+ system stands out thanks to its fully modular design.

The various modules can be combined in almost any configuration, thereby offering an incredible range of possible applications. In addition to the standard fluxer, preheating and mini-wave modules, there are also additional modules such as the Activeflow module, which uses product-specific cut-outs to ensure that the solder is applied only to the targeted areas of the printed circuit boards. It is also possible to connect several identical modules in series, which, for example, allows the heat to be distributed more evenly across the printed circuit board. Other available modules include the AOI module, the brush module and a cooling module.

Manufacturer:

Inertec

Product:

Cube Inline+

Product website

Brochure

Video

Send enquiry

The ELS 3.3 soldering system is designed as a soldering processing centre for in-line operation, with an interface to external transport systems.

For specialised applications, the soldering unit can be extended so that the crucible can accommodate up to four shafts in parallel. Thanks to the robust design of the soldering system and the professional X-Y-Z axis system with servo drives, components of high unit weight can be processed. It is therefore possible to integrate straightening and holding-down functions into the gripper mechanism. Thanks to the in-line arrangement of the individual components – fluxing, preheating and soldering – three workpiece carriers can be accommodated within the system, and the processes can be carried out independently of one another without affecting cycle times. To this end, a pin-chain conveyor is installed above the fluxing unit and the preheating section. A 40 mm soldering wave can be used for soldering small assemblies. A wide range of interchangeable nozzles is available for specialised soldering tasks. There is a suitable solution for almost every soldering task.