Separate

Precise sheet cutting for maximum quality in component assembly

Systronics AG’s cutting solutions enable components to be separated with precision, process reliability and minimal damage to the material. The focus is on high cutting quality, minimal mechanical stress and reproducible results. State-of-the-art laser technology is utilised to cut even sensitive assemblies cleanly and efficiently. Material-friendly, precise separation processes are becoming increasingly important, particularly for highly complex, densely populated or sensitive printed circuit boards. Systronics’ solutions are suitable for both flexible small-batch production and automated high-volume production, and can be seamlessly integrated into existing SMT and electronics manufacturing lines.

Stand-alone high-speed laser blanking machine

With SMEMA interface

The DP10x0 series meets all requirements for laser panel cutting of rigid and flexible printed circuit boards and cuts a variety of materials extremely quickly, without stress and without leaving any residue.

Using the FULL CUT process (cutting without splices), depending on the PCB design, up to 300% more panels can be accommodated and cut on a single PCB. By using a second galvanometer scanner, throughput can be doubled. The non-contact laser is virtually wear-free, resulting in extremely low operating costs.