Convection soldering

Convection soldering for reliable and cost-effective reflow soldering and tempering

Convection soldering is one of the most established and cost-effective soldering processes in modern electronics manufacturing. In this process, heat is transferred evenly to the assembly via precisely directed hot air, enabling the solder material to be melted in a controlled and reproducible manner. The process offers a high degree of process stability, particularly for SMT assemblies, and is suitable for both prototypes and small to medium-scale series production.

With the convection soldering solutions from Systronics AG Switzerland, companies gain access to flexible batch and in-line systems designed to meet a wide range of requirements in electronics production. The systems impress with their ease of use, short set-up times and reliable processing of even the most demanding assemblies with a wide variety of components. At the same time, modern control and temperature management systems ensure uniform heat distribution and stable reflow processes.

Full-convection reflow soldering systems

Optimised zone concept for efficient in-line soldering

SMT Thermal Discoveries’ reflow soldering systems are energy-efficient reflow ovens designed for precise and energy-efficient soldering processes in electronics manufacturing.

An optimised zoning concept and precisely controllable airflow result in a design suitable for a range of assemblies and requirements. In-line reflow ovens are a key component of modern SMT production lines and enable the automated mass production of electronic assemblies. The

Reflow ovens are used in SMT manufacturing to melt solder paste in a controlled manner and to create reliable solder joints between electronic components and printed circuit boards. The process involves defined temperature zones such as preheating, activation, reflow soldering and cooling.

Full convection technology enables uniform and efficient heat transfer and ensures high process stability whilst minimising energy consumption. Reflow soldering is one of the most important processes for joining electronic components to printed circuit boards in mass production.

Manufacturer:

SMT

Product:

R Series

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Pore- and void-free soldering is a fundamental requirement in high-performance electronics.

Life-support equipment, aircraft control systems and driver assistance systems in the automotive sector all have one thing in common: they must function with absolute safety and without fault for many years. A prerequisite for this is a virtually pore-free solder joint. Pores in a solder joint must therefore be reduced to an acceptable minimum. Vacuum reflow soldering systems from SMT Thermal Discoveries enable highly reliable and virtually pore-free solder joints in modern electronics manufacturing.

The targeted use of a vacuum during the brazing process removes any trapped gases from the brazing material. This results in a significantly improved quality of the brazed joints, which is crucial, particularly in demanding applications.

Why use a vacuum in the reflow process? Voids in solder joints can impair the performance and service life of electronic assemblies. The use of a vacuum specifically reduces these voids. This significantly improves the thermal conductivity and mechanical stability of the solder joint.

The vacuum reflow process therefore plays a key role in quality assurance within electronics manufacturing. Vacuum reflow soldering systems from SMT Thermal Discoveries combine high process reliability with maximum soldering quality. They are the ideal solution for companies that prioritise reliability, efficiency and the highest quality standards in their electronics manufacturing.

Manufacturer:

SMT

Product:

V Series

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Temperature control systems (T Series)

Temperature control systems for the heat treatment of electronic components

SMT’s temperature control systems enable precise temperature regulation for industrial applications with defined thermal requirements, product-specific curing and drying of adhesives, coatings, etc., as well as temperature control for functional testing.

These systems are used to ensure stable temperature conditions for heat transfer processes in electronics manufacturing. Temperature control refers to the controlled heating or cooling of materials or assemblies to ensure constant thermal conditions during and after the production process. Stable temperature control contributes to process stability, product quality and reproducibility.

SMT temperature control systems are designed for continuous industrial processes and enable uniform heat transfer whilst delivering high energy efficiency.

Manufacturer:

SMT

Product:

T Series

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Drawer-type reflow system for prototype or series production

Simple and intuitive to use for prototyping

Whether for prototype or mass production, the batch soldering system is the ideal solution for everyday use, combining ease of use with an affordable price.

The user-friendly interface enables quick and straightforward programming of custom soldering programmes, thereby reducing set-up times to a minimum.

The MRO250 can solder printed circuit boards measuring up to 350 x 250 mm and is easily transportable thanks to its light weight and compact dimensions.

Manufacturer:

Fritsch

Product:

MRO250

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Inline reflow soldering system

For small- and medium-volume production

The IRO850 reflow soldering system is the ideal solution for the production of small to medium-sized batches.

The hot-air convection oven guarantees environmentally friendly, lead-free soldering of printed circuit boards with a wide variety of components, including QFP, BGA/CSP, etc. It has an active chamber length of up to 850 mm, as well as a usable working width for the pin chain of 35–395 mm. Thanks to its user-friendly software, the system is easy to operate, allowing the settings to be adapted to the specific requirements of each soldering project.

Manufacturer:

Fritsch

Product:

IRO850